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RRD20TJ10SGC9 - ROHM Semiconductor

Description: Rectifying Diode

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PCB Footprints
RRD20TJ10SGC9 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220ACFP
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3D Models
RRD20TJ10SGC9 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220ACFP
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RRD20TJ10SGC9 Details

  • Manufacturer Part Number:

    RRD20TJ10SGC9

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220ACFP, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.05 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RRD20TJ10SGC9 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RRD20TJ10SGC9 can be found in the ROHM Semiconductor's package drawing document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad layout, dimensions, and spacing for optimal assembly and reliability.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or thermal interface material. Also, consider using a heat sink or a thermal management system, especially in high-power applications. Additionally, follow the recommended operating temperature range and derating guidelines provided in the datasheet.
  • The equivalent series resistance (ESR) of RRD20TJ10SGC9 is not explicitly stated in the datasheet. However, you can estimate the ESR by using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact ROHM Semiconductor's customer support or application engineers for more detailed information.
  • Yes, RRD20TJ10SGC9 is suitable for high-frequency applications. The device is designed to operate up to 100 kHz, and its impedance vs. frequency characteristics are provided in the datasheet. However, ensure that you follow the recommended operating conditions, and consider the device's parasitic inductance and capacitance when designing your circuit.
  • Select a voltage rating that is higher than the maximum operating voltage in your application. Consider the voltage derating guidelines provided in the datasheet, and ensure that the device's voltage rating is compatible with your system's voltage requirements.

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RRD20TJ10SGC9 Overview

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