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RRE07VTM4SFHTR - ROHM Semiconductor

Description: Automotive Standard Rectifier Diode (AEC-Q101 Qualified)

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RRE07VTM4SFHTR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RRE07VTM4SFHTR - ROHM Semiconductor PCB footprint - Other - Other - RRE07VTM4SFHTR-1
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3D Models
RRE07VTM4SFHTR - ROHM Semiconductor - 3D model - Other - RRE07VTM4SFHTR-1
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RRE07VTM4SFHTR Details

  • Manufacturer Part Number:

    RRE07VTM4SFHTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.07

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    2 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.7 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RRE07VTM4SFHTR Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • The maximum power dissipation for the RRE07VTM4SFHTR is 1.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB.
  • While the RRE07VTM4SFHTR is not specifically designed for high-humidity environments, it can still be used in such conditions with proper precautions. Apply a conformal coating to the device and ensure the PCB is designed with moisture-resistant materials.
  • Store the RRE07VTM4SFHTR in a dry, dark place with a temperature range of -10°C to 30°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.

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RRE07VTM4SFHTR Overview

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