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RS1L145GNTB - ROHM Semiconductor

Description: Nch 60V 47A Power MOSFET, VDSS 60V, RDS(on)(Max.) 9.7mΩ, ID ±47A, PD 31W

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PCB Footprints
RS1L145GNTB - ROHM Semiconductor PCB footprint - Other - Other - RS1L145GNTB-2
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RS1L145GNTB - ROHM Semiconductor  - 3D model - Other - RS1L145GNTB-2
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RS1L145GNTB Details

  • Manufacturer Part Number:

    RS1L145GNTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HSOP-8

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-06-01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    31 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    14.5 A

  • Drain-source On Resistance-Max:

    0.0141 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    95 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    31 W

  • Pulsed Drain Current-Max (IDM):

    58 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RS1L145GNTB Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power dissipation at high temperatures.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a temperature slope of 3°C/s. Refer to the ROHM soldering guidelines for more information.
  • Yes, the RS1L145GNTB is designed to withstand vibrations up to 10G. However, ensure that the PCB is properly secured and the device is properly soldered to prevent mechanical stress.
  • Handle the device with ESD precautions, such as using an ESD wrist strap or mat. Ensure that the PCB has ESD protection circuits, such as TVS diodes or ESD protection arrays, to prevent damage from electrostatic discharge.

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RS1L145GNTB Overview

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