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RS2103XH - RUNIC

Description: IC SWITCH SPDT X 1 1OHM SOT23-6

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PCB Footprints
RS2103XH - RUNIC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - RS2103XH
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3D Models
RS2103XH - RUNIC  - 3D model - SOT23 (6-Pin) - RS2103XH
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RS2103XH Details

  • Manufacturer Part Number:

    RS2103XH

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    SOT-23, 6 PIN

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    RUNIC

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2.92 mm

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    1.7 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.25 mm

  • Signal Current-Max:

    0.5 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

RS2103XH Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 125°C) and ensure proper heat sinking. Additionally, consider using a thermal interface material (TIM) between the device and the heat sink to improve thermal conductivity.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection during handling and assembly, follow standard ESD precautions such as using an ESD wrist strap, ESD mat, or ESD-safe packaging. Additionally, ensure that the device is handled in a static-safe environment, and avoid touching the device's pins or exposed pads.
  • The recommended storage conditions for the RS2103XH include storing the devices in their original packaging, in a dry, cool place (below 30°C and 60% relative humidity), and away from direct sunlight. Avoid exposing the devices to moisture, extreme temperatures, or physical stress.

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RS2103XH Overview

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