RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, RECOM recommends following the derating curves provided in the datasheet, using a suitable heat sink, and ensuring good airflow around the module. Additionally, the module should be operated within the specified temperature range and the input voltage should be kept within the recommended range.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range, as close as possible to the module's input pins. This helps to reduce input ripple and ensure stable operation.
Yes, the RS3-4805SZ can be used in a redundant configuration to achieve high reliability. However, it is essential to ensure that the modules are properly synchronized and that the system is designed to handle the increased power consumption and heat generation.
According to RECOM, the typical MTBF for the RS3-4805SZ is >1.5 million hours at 40°C ambient temperature, calculated according to MIL-HDBK-217F.
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