ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a thermal interface material (TIM) between the device and heat sink. Also, follow the recommended operating temperature range and derate the device accordingly.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-5°C/s. Refer to the ROHM soldering guidelines for more details.
The RS3E075ATTB1 is not designed for high-humidity environments. If operation in high humidity is required, consider using a device with a moisture-sensing feature or applying conformal coating to protect the device.
Store the device in a dry, dark place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.
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RS3E075ATTB1 Overview
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