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RS3G160ATTB1 - ROHM Semiconductor

Description: Pch -40V -16A Power MOSFET

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RS3G160ATTB1 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP8-ROHM
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RS3G160ATTB1 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP8-ROHM
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RS3G160ATTB1 Details

  • Manufacturer Part Number:

    RS3G160ATTB1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2020-11-05

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    18 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    16 A

  • Drain-source On Resistance-Max:

    0.0076 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    540 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    64 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RS3G160ATTB1 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
  • The maximum allowable voltage on the input pins is 5.5V. Exceeding this voltage may cause damage to the device.
  • Use an ESD wrist strap or mat during handling and assembly. Ensure that the device is stored in an anti-static bag or container. Avoid touching the device's pins or handling it in a way that may generate static electricity.
  • Use a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Avoid exceeding 280°C (536°F) to prevent damage to the device.

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RS3G160ATTB1 Overview

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