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RS624XQ - RUNIC

Description: IC CMOS 4 CIRCUIT 14TSSOP

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Symbol
RS624XQ - RUNIC - PCB symbol
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PCB Footprints
RS624XQ - RUNIC PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP14
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3D Models
RS624XQ - RUNIC - 3D model - Small Outline Packages - TSSOP14
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RS624XQ Details

  • Manufacturer Part Number:

    RS624XQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    TSSOP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    RUNIC

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    4.98 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    3.7 V/us

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    14125.37545

  • Wideband:

    NO

  • Width:

    4.4 mm

RS624XQ Frequently Asked Questions (FAQs)

  • RUNIC recommends a 4-layer PCB with a dedicated ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the power traces. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal interface material.
  • To ensure reliable operation in high-vibration environments, RUNIC recommends securing the device with a robust mechanical fastening system, such as screws or clips. Additionally, the PCB should be designed with a rigid structure and anchored to the chassis to minimize flexure.
  • According to RUNIC, the maximum allowable voltage transient on the input pins is ±20% of the rated voltage for a duration of up to 100 ms. Exceeding this limit may cause damage to the device.
  • Yes, the RS624XQ can be used in a parallel configuration to increase output current. However, RUNIC recommends using a master-slave configuration with a dedicated current-sharing bus to ensure stable operation and prevent oscillations.
  • RUNIC recommends using a low-ESR ceramic capacitor with a value of 10-22 μF in parallel with a 10-100 nF film capacitor as close to the input pins as possible. This configuration helps to filter out high-frequency noise and ensure stable operation.

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RS624XQ Overview

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