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RS8452XK - RUNIC

Description: CMOS Amplifier 2 Circuit Rail-to-Rail 8-SOIC

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PCB Footprints
RS8452XK - RUNIC PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8(SOP8)_2024
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3D Models
RS8452XK - RUNIC  - 3D model - Small Outline Packages - SOIC-8(SOP8)_2024
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RS8452XK Details

  • Manufacturer Part Number:

    RS8452XK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    RUNIC

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    25118.86432

  • Wideband:

    NO

  • Width:

    3.9 mm

RS8452XK Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. The datasheet provides a recommended PCB layout, but it's essential to follow good thermal design practices to ensure the device operates within its specified temperature range.
  • To ensure reliable operation in high-vibration environments, it's essential to follow proper mounting and soldering procedures. Use a robust PCB mounting method, such as screw mounting or adhesive mounting, and ensure the device is securely attached to the PCB. Additionally, use a vibration-resistant solder alloy and follow the recommended soldering profile.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, decreased lifespan, and potentially even device failure. It's essential to ensure the device operates within its specified temperature range to maintain reliability and performance.
  • To troubleshoot issues with the device's internal oscillator, start by verifying the oscillator circuit is properly connected and configured. Check the oscillator's output frequency and amplitude using an oscilloscope or frequency counter. If the issue persists, consult the datasheet for troubleshooting guidelines or contact RUNIC's technical support for assistance.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or use an ESD wrist strap or mat. Ensure the PCB is designed with ESD protection in mind, including the use of ESD protection diodes and resistors. Follow proper soldering and handling procedures to minimize the risk of ESD damage.

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RS8452XK Overview

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