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RSB27F2FHT106 - ROHM Semiconductor

Description: ROHM - RSB27F2FHT106 - Zener Array Diode, 27 V, Dual Series, 200 mW, 150 °C, SOT-323

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RSB27F2FHT106 - ROHM Semiconductor PCB footprint - Other - Other - RSB27F2FHT106
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RSB27F2FHT106 Details

  • Manufacturer Part Number:

    RSB27F2FHT106

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    27 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    9.97%

  • Working Test Current:

    1 mA

RSB27F2FHT106 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Monitor the device's voltage, current, and temperature to ensure they are within the specified limits. Use a thermal management system to prevent overheating.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. Avoid exceeding 280°C to prevent damage.
  • Yes, the RSB27F2FHT106 is qualified to AEC-Q101, making it suitable for high-reliability applications such as automotive systems.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure all equipment is grounded to prevent static buildup.

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RSB27F2FHT106 Overview

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