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RSD100N10TL - ROHM Semiconductor

Description: ROHM RSD100N10TL N-channel MOSFET, 10 A, 100 V RSD100N10, 3+Tab-Pin SOT-428

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RSD100N10TL - ROHM Semiconductor PCB footprint - Other - Other - RSD100N10TL-3
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RSD100N10TL Details

  • Manufacturer Part Number:

    RSD100N10TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SC-63

  • Package Description:

    CPT3, SC-63, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.147 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSD100N10TL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RSD100N10TL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating curves for the device, and consider the thermal resistance and power dissipation of the package.
  • The recommended land pattern for the RSD100N10TL is a thermal pad with a minimum size of 2.5mm x 2.5mm, and a non-functional pad with a minimum size of 1.5mm x 1.5mm.
  • Yes, the RSD100N10TL is suitable for high-frequency switching applications up to 1MHz, but it's essential to consider the device's switching characteristics and ensure proper PCB layout and decoupling.
  • During PCB assembly, it's recommended to use a thermal interface material (TIM) between the thermal pad and the heat sink to ensure good thermal conductivity.

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