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RSF014N03TL - ROHM Semiconductor

Description: 4V Drive Nch MOSFET

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RSF014N03TL - ROHM Semiconductor PCB footprint - Other - Other - TUMT3 Master
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RSF014N03TL - ROHM Semiconductor  - 3D model - Other - TUMT3 Master
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RSF014N03TL Details

  • Manufacturer Part Number:

    RSF014N03TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TUMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.38 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.8 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSF014N03TL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RSF014N03TL is -40°C to 150°C.
  • To ensure reliability, it is recommended to follow the derating guidelines provided in the datasheet, and to consider the thermal design and heat dissipation of the system.
  • The recommended PCB layout and thermal design for the RSF014N03TL involves using a thermal pad, thermal vias, and a heat sink to ensure efficient heat dissipation. ROHM Semiconductor provides a reference design and layout guidelines in the datasheet.
  • To handle the high current handling capability of the RSF014N03TL, it is recommended to use a robust PCB design, ensure proper thermal management, and consider the current rating and power dissipation of the device.
  • The RSF014N03TL has built-in ESD protection and latch-up prevention measures, including a protection diode and a latch-up protection circuit. However, it is still recommended to follow proper ESD handling and storage procedures to prevent damage.

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RSF014N03TL Overview

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