RSH2-0505S/H3 - RECOM Power

RSH2-0505S/H3 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• Can I use this module in a high-vibration environment?
  Yes, the RSH2-0505S/H3 is designed to withstand high vibrations. It is built with a rugged construction and has undergone vibration testing according to IEC 60068-2-6. However, it's recommended to consult with RECOM's application engineers to ensure the module meets the specific vibration requirements of your application.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, it's essential to follow RECOM's derating guidelines for temperature. The module's power rating should be derated according to the ambient temperature, and the module should be installed in a well-ventilated area to prevent overheating.
• Can I use this module in a humid or wet environment?
  The RSH2-0505S/H3 has a conformal coating to protect it from humidity and moisture. However, it's not designed for immersion in water or exposure to high-pressure water jets. If your application requires operation in a humid or wet environment, consult with RECOM's application engineers to discuss additional protection measures.
• What is the recommended input capacitor value and type for this module?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.