Please enter a minimum 3 letters or numbers
Technical Content
Part Image

RSJ301N10TL - ROHM Semiconductor

Description: Nch 100V 30A Power MOSFET

Download RSJ301N10TL Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
RSJ301N10TL - ROHM Semiconductor - PCB symbol
click to zoom
PCB Footprints
RSJ301N10TL - ROHM Semiconductor PCB footprint - Other - Other - LPTS_Master
click to zoom
3D Models
RSJ301N10TL - ROHM Semiconductor - 3D model - Other - LPTS_Master
click to zoom

RSJ301N10TL Details

  • Manufacturer Part Number:

    RSJ301N10TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SC-83, TO-263S, D2PAK-3/2

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-11-27

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    30 A

  • Drain-source On Resistance-Max:

    0.05 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSJ301N10TL Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal design, and consider the maximum junction temperature (Tj) of 150°C.
  • The maximum allowed voltage for the gate-source (Vgs) is ±20V, and for the gate-drain (Vgd) it's ±20V, but it's recommended to keep it within ±15V for reliable operation.
  • Yes, the RSJ301N10TL is suitable for high-frequency switching applications up to 1MHz, but it's essential to consider the gate charge, switching losses, and parasitic inductances to ensure reliable operation.
  • The gate resistor value depends on the driving circuit, PCB layout, and switching frequency. A general guideline is to use a value between 10Ω to 100Ω, but it's recommended to consult the application note or contact ROHM support for specific guidance.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

RSJ301N10TL Overview

Use the download button to access the RSJ301N10TL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RSJ30, or try a keyword search, such as Power Field-Effect Transistors

Parts related to RSJ301N10TL

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑