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RSR010N10TL - ROHM Semiconductor

Description: MOSFET 4V Drive Nch MOSFET

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RSR010N10TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RSR010N10TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - RSR010N10TL
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3D Models
RSR010N10TL - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - RSR010N10TL
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RSR010N10TL Details

  • Manufacturer Part Number:

    RSR010N10TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    1 A

  • Drain-source On Resistance-Max:

    0.58 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSR010N10TL Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for RSR010N10TL is a 0603 package with a land pattern of 0.8mm x 0.8mm. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curve for the device. Additionally, consider using a thermal pad or heat sink to dissipate heat, and ensure good airflow around the device.
  • The maximum allowable power dissipation for RSR010N10TL is 1.5W. Exceeding this limit can lead to device failure. Ensure that the device is operated within the recommended power dissipation limits to ensure reliability.
  • While RSR010N10TL is a high-speed device, it's not recommended for high-frequency switching applications above 100kHz. The device is optimized for low-frequency switching applications, and high-frequency operation may lead to reduced performance and reliability.
  • To ensure ESD protection for RSR010N10TL, follow proper handling and storage procedures. Use an anti-static wrist strap or mat when handling the device, and store the device in an anti-static bag or container. Additionally, consider using ESD protection devices, such as TVS diodes, in the circuit design.

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RSR010N10TL Overview

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