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RSR025N03TL - ROHM Semiconductor

Description: 4V Drive Nch MOSFET: Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications.Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

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RSR025N03TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RSR025N03TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-346_4
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3D Models
RSR025N03TL - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - SOT-346_4
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RSR025N03TL Details

  • Manufacturer Part Number:

    RSR025N03TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.5 A

  • Drain-source On Resistance-Max:

    0.118 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSR025N03TL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RSR025N03TL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines, ensure proper thermal management, and consider the device's thermal resistance and power dissipation.
  • A recommended PCB layout and thermal design for the RSR025N03TL involves using a thermal pad, thermal vias, and a heat sink to dissipate heat efficiently. Consult ROHM's application notes for specific guidelines.
  • The RSR025N03TL requires a specific power sequencing and startup procedure to prevent damage. Consult the datasheet and application notes for detailed information on power-up and power-down sequences.
  • The RSR025N03TL is sensitive to electrostatic discharge (ESD). Handle the device with ESD-protective equipment, and follow proper handling and storage procedures to prevent damage.

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RSR025N03TL Overview

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