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RSR030N06HZGTL - ROHM Semiconductor

Description: Automotive Nch 60V 3A Small Signal MOSFET

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Symbol
RSR030N06HZGTL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RSR030N06HZGTL - ROHM Semiconductor PCB footprint - Other - Other - TSMT3_2022-8
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3D Models
RSR030N06HZGTL - ROHM Semiconductor - 3D model - Other - TSMT3_2022-8
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RSR030N06HZGTL Details

  • Manufacturer Part Number:

    RSR030N06HZGTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-96, SOT-346T, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2018-08-27

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.105 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    45 pF

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSR030N06HZGTL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RSR030N06HZGTL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines for the device, especially in high-temperature applications. This includes reducing the voltage and current ratings as the temperature increases.
  • For optimal thermal performance, it's recommended to use a PCB layout with a large copper area for heat dissipation. Additionally, a thermal pad or heat sink can be used to further improve heat dissipation.
  • To protect the RSR030N06HZGTL from ESD, it's essential to follow proper handling and storage procedures, such as using anti-static bags or containers, and grounding oneself before handling the device.
  • The recommended soldering conditions for the RSR030N06HZGTL include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering iron temperature of 350°C or less.

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RSR030N06HZGTL Overview

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