ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure proper heat sinking, keep the device away from heat sources, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Also, consider derating the power dissipation at high temperatures.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less to prevent thermal shock.
Yes, but ensure proper moisture protection measures are taken, such as conformal coating or potting, to prevent moisture ingress. ROHM recommends following the IPC-J-STD-020 standard for moisture sensitivity.
Handle the device with ESD-protective equipment, such as wrist straps or mats, and ensure the PCB has ESD protection circuits, such as TVS diodes or resistors, to prevent damage from electrostatic discharge.
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RSS060P05HZGTB Overview
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