ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including derating the output current and voltage according to the temperature. Additionally, consider using a heat sink or thermal management system to keep the junction temperature below 125°C.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 4.7μF to 10μF, depending on the input voltage and output current requirements. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ripple.
To minimize EMI, follow proper PCB layout practices, such as separating analog and digital grounds, using a solid ground plane, and minimizing loop areas. Additionally, consider adding EMI filters, such as ferrite beads or common-mode chokes, to the input and output lines.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 10μF to 22μF, depending on the output current and voltage requirements. The capacitor should be placed as close as possible to the VOUT pin to minimize noise and ripple.
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