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RT0603FRE0717K8L - Yageo Group

Description: RT0603FRE0717K8L

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RT0603FRE0717K8L - Yageo Group - PCB symbol
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PCB Footprints
RT0603FRE0717K8L - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT0603
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RT0603FRE0717K8L - Yageo Group - 3D model - Resistor Chip - RT0603
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RT0603FRE0717K8L Details

  • Manufacturer Part Number:

    RT0603FRE0717K8L

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    17800 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

RT0603FRE0717K8L Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0603FRE0717K8L is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, RT0603FRE0717K8L is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • RT0603FRE0717K8L is a moisture-sensitive device, and it's essential to follow proper handling and storage procedures to prevent moisture absorption. The component should be stored in a dry environment, and baking may be required before reflow soldering to remove any absorbed moisture.
  • The recommended soldering profile for RT0603FRE0717K8L is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering profile to prevent overheating and ensure reliable solder joints.
  • Yes, RT0603FRE0717K8L is designed to withstand high-vibration environments, with a vibration resistance of 10G (10-2000Hz). However, it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the expected vibration levels.

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RT0603FRE0717K8L Overview

Use the download button to access the RT0603FRE0717K8L schematic symbol, PCB footprint, and 3D model.
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