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RT0805BRD0727RL - Yageo Group

Description: Thin Film Resistors - SMD 1/8W 27 ohm .1% 25ppm

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RT0805BRD0727RL - Yageo Group - PCB symbol
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PCB Footprints
RT0805BRD0727RL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT0805
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RT0805BRD0727RL - Yageo Group - 3D model - Resistor Chip - RT0805
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RT0805BRD0727RL Details

  • Manufacturer Part Number:

    RT0805BRD0727RL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    27 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    150 V

RT0805BRD0727RL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805BRD0727RL is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • RT0805BRD0727RL is rated for operation up to 150°C, but it's recommended to derate the component's power rating and consider the application's thermal management to ensure reliable operation. Consult YAGEO's application notes for high-temperature usage guidelines.
  • RT0805BRD0727RL is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Follow YAGEO's recommended storage and handling procedures, and ensure the component is baked according to the datasheet's instructions before reflow soldering.
  • The recommended soldering profile for RT0805BRD0727RL is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult YAGEO's application notes for more detailed soldering profile guidelines.
  • Yes, RT0805BRD0727RL is lead-free and RoHS-compliant, making it suitable for lead-free assembly processes. However, ensure that the assembly process meets the component's recommended soldering profile and handling guidelines.

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RT0805BRD0727RL Overview

Use the download button to access the RT0805BRD0727RL schematic symbol, PCB footprint, and 3D model.
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