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RT0805FRE0733RL - Yageo Group

Description: RESISTOR, 0805 33 Ohms ±1% 1/8 W

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RT0805FRE0733RL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - 0805-1
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RT0805FRE0733RL - Yageo Group  - 3D model - Resistor Chip - 0805-1
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RT0805FRE0733RL Details

  • Manufacturer Part Number:

    RT0805FRE0733RL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    33 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

RT0805FRE0733RL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805FRE0733RL is a rectangular pad with a size of 0.8mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • RT0805FRE0733RL is rated for operation up to 150°C, but it's not recommended for use in high-temperature applications above 125°C without derating. The component's electrical characteristics and reliability may be affected at higher temperatures. Consult the manufacturer's application notes for guidance on high-temperature use.
  • RT0805FRE0733RL is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. It's essential to handle the component according to the manufacturer's guidelines to prevent moisture-related damage. Store the components in a dry environment, and follow the recommended baking and soldering procedures to minimize the risk of damage.
  • The recommended soldering profile for RT0805FRE0733RL is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be designed to minimize thermal shock and ensure good solder joint reliability. Consult the manufacturer's application notes for more detailed guidance on soldering profiles.
  • RT0805FRE0733RL is designed for general-purpose use and may not be suitable for high-vibration or high-shock applications. The component's mechanical robustness and solder joint reliability may be affected by extreme mechanical stress. Consult the manufacturer's application notes or consider using a more ruggedized component for such applications.

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RT0805FRE0733RL Overview

Use the download button to access the RT0805FRE0733RL schematic symbol, PCB footprint, and 3D model.
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Part Image RN732ALTE33R0F50 KOA Speer Electronics Inc

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For a full list of alternate parts for RT0805FRE0733RL, check out Findchips.com