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RT0805FRE131RL - Yageo Group

Description: Thin Film Resistors - SMD 1 ohm 1% 50 ppm Thin Film

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Symbol
RT0805FRE131RL - Yageo Group - PCB symbol
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PCB Footprints
RT0805FRE131RL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT0805
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3D Models
RT0805FRE131RL - Yageo Group - 3D model - Resistor Chip - RT0805
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RT0805FRE131RL Details

  • Manufacturer Part Number:

    RT0805FRE131RL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 13 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

RT0805FRE131RL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805FRE131RL is a rectangular pad with a size of 0.8mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • RT0805FRE131RL has a maximum operating temperature of 125°C, making it suitable for most industrial and commercial applications. However, it's essential to consider the component's derating curve and ensure that the operating temperature does not exceed the recommended maximum temperature to prevent degradation or failure.
  • RT0805FRE131RL is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. It's essential to handle the component according to the recommended storage and handling procedures to prevent moisture absorption, which can lead to defects or failures during soldering.
  • The recommended soldering profile for RT0805FRE131RL is a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time above 220°C of 20-30 seconds. It's essential to follow the recommended soldering profile to ensure reliable solder joints and prevent component damage.
  • RT0805FRE131RL is a surface-mount device (SMD) designed for general-purpose applications. While it can withstand some level of vibration and shock, it's essential to consider the component's mechanical stress limits and ensure that the application's environmental conditions do not exceed the recommended specifications.

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RT0805FRE131RL Overview

Use the download button to access the RT0805FRE131RL schematic symbol, PCB footprint, and 3D model.
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