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RT1206BRB07249RL - Yageo Group

Description: 249 Ohms ±0.1% 0.25W, 1/4W Chip Resistor 1206 (3216 Metric) Thin Film

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RT1206BRB07249RL - Yageo Group - PCB symbol
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PCB Footprints
RT1206BRB07249RL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT1206_
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RT1206BRB07249RL - Yageo Group - 3D model - Resistor Chip - RT1206_
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RT1206BRB07249RL Details

  • Manufacturer Part Number:

    RT1206BRB07249RL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    249 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    10 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    200 V

RT1206BRB07249RL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT1206BRB07249RL is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • RT1206BRB07249RL is rated for operation up to 150°C, but it's recommended to derate the component's power rating and consider the application's thermal management when operating at high temperatures. Consult YAGEO's application notes for more information.
  • RT1206BRB07249RL is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Follow YAGEO's recommended storage and handling procedures, and ensure the component is baked according to the datasheet's instructions before reflow soldering.
  • The recommended soldering profile for RT1206BRB07249RL is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure the soldering process is within the component's specified temperature range to prevent damage.
  • Yes, RT1206BRB07249RL is compatible with lead-free soldering processes. However, ensure the soldering profile is adjusted according to the lead-free solder alloy's requirements, and follow YAGEO's recommended soldering conditions.

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RT1206BRB07249RL Overview

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Part Image TP0610B2490RCE Royal Electronic Factory (Thailand) Co Ltd

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