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RT1206BRD07390KL - Yageo Group

Description: Thin Film Resistors - SMD 1/4W 390K ohm .1% 25ppm

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Symbol
RT1206BRD07390KL - Yageo Group - PCB symbol
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PCB Footprints
RT1206BRD07390KL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - 1206
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3D Models
RT1206BRD07390KL - Yageo Group - 3D model - Resistor Chip - 1206
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RT1206BRD07390KL Details

  • Manufacturer Part Number:

    RT1206BRD07390KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    390000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    200 V

RT1206BRD07390KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT1206BRD07390KL is a rectangular pad with a size of 1.3mm x 0.6mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • RT1206BRD07390KL has a maximum operating temperature of 150°C, making it suitable for most industrial and commercial applications. However, it's essential to ensure that the component is used within its specified temperature range to maintain its performance and reliability.
  • To prevent damage during assembly, handle RT1206BRD07390KL by the edges, avoid touching the component's termination, and use anti-static wrist straps or mats to prevent electrostatic discharge (ESD). Additionally, ensure that the component is placed on a clean and dry surface to prevent contamination.
  • The recommended soldering profile for RT1206BRD07390KL is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation and ensure good solder joint reliability.
  • Yes, RT1206BRD07390KL is compatible with lead-free soldering processes. The component is designed to meet the requirements of RoHS (Restriction of Hazardous Substances) and is suitable for use with lead-free solders such as SAC305 (Sn-Ag-Cu).

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RT1206BRD07390KL Overview

Use the download button to access the RT1206BRD07390KL schematic symbol, PCB footprint, and 3D model.
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