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RT1206DRD0751RL - Yageo Group

Description: Thin Film Resistors - SMD 51 OHM .5% 25PPM 1/4 W

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RT1206DRD0751RL - Yageo Group - PCB symbol
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PCB Footprints
RT1206DRD0751RL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT1206-ren1
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RT1206DRD0751RL - Yageo Group - 3D model - Resistor Chip - RT1206-ren1
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RT1206DRD0751RL Details

  • Manufacturer Part Number:

    RT1206DRD0751RL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    51 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    200 V

RT1206DRD0751RL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT1206DRD0751RL is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • RT1206DRD0751RL has a maximum operating temperature of 125°C, making it suitable for most industrial and commercial applications. However, it's essential to ensure that the component is not exposed to temperatures above the recommended maximum rating to prevent degradation or failure.
  • Handle the RT1206DRD0751RL component by the edges or body to prevent damage to the terminations. Avoid touching the component's leads or pads to prevent contamination and ensure good solderability. During rework, use a low-temperature soldering iron and a solder with a low melting point to prevent damage to the component or the PCB.
  • The MSL of RT1206DRD0751RL is 2, which means it can withstand exposure to moisture for up to 4 days without requiring baking before reflow soldering. However, it's recommended to follow the manufacturer's guidelines for handling and storage to prevent moisture absorption.
  • RT1206DRD0751RL is not AEC-Q200 qualified, which means it may not meet the stringent requirements for automotive applications. If AEC-Q200 compliance is required, it's recommended to use a qualified component or consult with the manufacturer for alternative options.

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RT1206DRD0751RL Overview

Use the download button to access the RT1206DRD0751RL schematic symbol, PCB footprint, and 3D model.
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