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RT1206FRD07100KL - Yageo Group

Description: 2 pin

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RT1206FRD07100KL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - 1206-ren12
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RT1206FRD07100KL - Yageo Group  - 3D model - Resistor Chip - 1206-ren12
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RT1206FRD07100KL Details

  • Manufacturer Part Number:

    RT1206FRD07100KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    100000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RT1206FRD07100KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT1206FRD07100KL is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • To handle thermal management of RT1206FRD07100KL, ensure good thermal conduction by using a thermal via or a thermal pad under the component. Also, consider using a thermal interface material (TIM) between the component and the heat sink, if necessary. Follow the recommended thermal design guidelines in the datasheet and application notes.
  • The moisture sensitivity level (MSL) of RT1206FRD07100KL is MSL 2, which means it can withstand a maximum of 4 days of exposure to a humidity level of 60% at 30°C before soldering. Proper storage and handling procedures should be followed to prevent moisture absorption.
  • Yes, RT1206FRD07100KL is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the component's self-resonant frequency, parasitic inductance, and capacitance when designing the circuit. Consult the datasheet and application notes for more information on high-frequency usage.
  • To ensure the reliability of RT1206FRD07100KL in a harsh environment, follow the recommended operating conditions, storage, and handling guidelines. Consider using conformal coating, potting, or encapsulation to protect the component from environmental stressors like humidity, temperature, and vibration.

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RT1206FRD07100KL Overview

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Part Image AT1206FRD07100KL YAGEO Corporation

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Part Image CAR1206100KOHMS1%25PPMHP Riedon

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For a full list of alternate parts for RT1206FRD07100KL, check out Findchips.com