- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for RT1206FRE0756KL
- Part Number RT1206FRE0756KL
- Manufacturer Yageo Group
- Pin Count 2
- Part Category Resistor
- Package Category Resistor Chip
- Footprint Name Resistor Chip - RT1206FRE0756KL
- Released Date Apr 23, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
RT1206FRE0756KL Details
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Manufacturer Part Number:
RT1206FRE0756KL
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Mainland China, Taiwan
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
16 Weeks
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Manufacturer:
YAGEO Corporation
RT1206FRE0756KL Frequently Asked Questions (FAQs)
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The recommended land pattern for RT1206FRE0756KL is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
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To handle thermal management of RT1206FRE0756KL, ensure good thermal conduction by using a thermal pad or a heat sink, and design the PCB to allow for good airflow. The component's thermal resistance (Rth) is 350°C/W, so it's essential to keep the operating temperature below 125°C to ensure reliability.
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The moisture sensitivity level (MSL) of RT1206FRE0756KL is MSL 2, which means it can withstand a maximum of 24 hours of exposure to moisture before soldering. Proper storage and handling procedures should be followed to prevent moisture absorption.
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RT1206FRE0756KL is a surface-mount device, and its reliability in high-vibration environments depends on the PCB design, component placement, and solder joint quality. Ensure that the PCB is designed to withstand vibrations, and the component is properly secured to the board using a suitable adhesive or mechanical fastening method.
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The recommended soldering profile for RT1206FRE0756KL is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation. Ensure that the soldering iron is set to the correct temperature, and the component is properly aligned with the land pattern.
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RT1206FRE0756KL Overview
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