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RT2872GSP - RICHTEK

Description: IC REG BUCK ADJUSTABLE 3A 8SOP

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PCB Footprints
RT2872GSP - RICHTEK PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead SOP
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RT2872GSP - RICHTEK  - 3D model - Small Outline Packages - 8-Lead SOP
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RT2872GSP Details

  • Manufacturer Part Number:

    RT2872GSP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PSOP-8

  • Manufacturer Package Code:

    PSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Richtek Technology Corp

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9025 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    30 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.753 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1120 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.905 mm

RT2872GSP Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the RT2872GSP can be found in the Richtek application note AND9131, which provides guidelines for PCB layout, component placement, and thermal management.
  • To optimize the RT2872GSP for low power consumption, ensure that the device is operated in the correct power mode (e.g., low-power mode or shutdown mode) when not in use. Additionally, optimize the external component selection, such as using low-ESR capacitors and low-quiescent-current regulators.
  • The RT2872GSP has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. Ensure that the thermal plane is connected to a heat sink or a metal plate to effectively dissipate heat.
  • To troubleshoot issues with the RT2872GSP, start by checking the power supply voltage, input voltage, and output voltage. Verify that the device is properly configured and that the external components are correctly selected. Use an oscilloscope to monitor the output voltage and current, and consult the Richtek application notes and datasheet for troubleshooting guidelines.
  • To minimize EMI and EMC issues with the RT2872GSP, ensure that the PCB layout is designed to minimize radiation and conduction. Use shielding, filtering, and grounding techniques to reduce EMI. Consult the Richtek application notes and datasheet for specific guidelines on EMI and EMC considerations.

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RT2872GSP Overview

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