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RTQ035N03TR - ROHM Semiconductor

Description: ROHM RTQ035N03TR N-channel MOSFET Transistor, 3.5 A, 30 V, 6-Pin TSMT

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PCB Footprints
RTQ035N03TR - ROHM Semiconductor PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSMT6
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3D Models
RTQ035N03TR - ROHM Semiconductor  - 3D model - SOT23 (6-Pin) - TSMT6
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RTQ035N03TR Details

  • Manufacturer Part Number:

    RTQ035N03TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT6, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3.5 A

  • Drain-source On Resistance-Max:

    0.077 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.25 W

  • Pulsed Drain Current-Max (IDM):

    15 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RTQ035N03TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for RTQ035N03TR is -40°C to 150°C.
  • To ensure reliability, follow the recommended derating guidelines, use a suitable thermal management system, and consider using a heat sink or thermal interface material.
  • Follow the recommended PCB layout guidelines in the datasheet, use a thermal via array, and consider using a thermal pad or heat sink to improve thermal dissipation.
  • Use a suitable PCB design with wide traces, ensure proper thermal management, and consider using a current sense resistor to monitor current flow.
  • Follow the recommended ESD protection guidelines, use a suitable ESD protection device, and ensure proper PCB design and layout to prevent latch-up.

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RTQ035N03TR Overview

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