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RUM001L02T2CL - ROHM Semiconductor

Description: 1.2V Drive Nch MOSFET

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RUM001L02T2CL - ROHM Semiconductor PCB footprint - Other - Other - SOT723
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3D Models
RUM001L02T2CL - ROHM Semiconductor  - 3D model - Other - SOT723
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RUM001L02T2CL Details

  • Manufacturer Part Number:

    RUM001L02T2CL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.1 A

  • Drain-source On Resistance-Max:

    4.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RUM001L02T2CL Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance of RUM001L02T2CL is to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
  • The maximum allowable voltage that can be applied to the RUM001L02T2CL is 12V, as specified in the datasheet. Exceeding this voltage may result in damage to the device.
  • To protect the RUM001L02T2CL from ESD, it is recommended to follow proper handling and storage procedures, such as using anti-static bags or trays, and grounding oneself before handling the device.
  • The recommended soldering profile for the RUM001L02T2CL is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less.

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RUM001L02T2CL Overview

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