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RURG8060 - onsemi

Description: 600V Reverse Voltage and High Reliability; Ultrafast recovery Trr = 85ns (@IF= 80A); Avalanche Energy Rated; Max Forward Voltage, VF = 1.6V (@ TC = 25°C); RoHS compliant

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RURG8060 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - RURG8060
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RURG8060 - onsemi  - 3D model - Transistor Outline, Vertical - RURG8060
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RURG8060 Details

  • Manufacturer Part Number:

    RURG8060

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247-2

  • Manufacturer Package Code:

    340CL

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.4 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    800 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    80 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    150 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    250 µA

  • Reverse Recovery Time-Max:

    0.085 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RURG8060 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a proper heat sink design, ensure good airflow, and consider using a thermal interface material (TIM) to reduce thermal resistance. Monitor junction temperature (TJ) and adjust the design accordingly.
  • Use a dedicated gate driver IC with a high current capability (>1A) and a low output impedance. Ensure the driver is capable of providing a fast rise and fall time (<10ns) and a high voltage swing (>10V).
  • Use a shielded enclosure, keep the layout compact, and minimize loop areas. Implement a common-mode choke and a differential-mode filter to reduce EMI. Ensure proper grounding and decoupling of the device.
  • Use a curve tracer or a high-power semiconductor parameter analyzer to measure the device's characteristics. Ensure proper fixture design and calibration to minimize measurement errors.

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RURG8060 Overview

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Part Image RURG8060 Fairchild Semiconductor Corporation

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Part Image RURG8060_NL Fairchild Semiconductor Corporation

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Part Image RURG8060 Intersil Corporation

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