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RVC2512FT2M00 - Stackpole Electronics, Inc.

Description: RES, HV, 2512, 1%, 2 Mohm, 1W

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RVC2512FT2M00 Details

  • Manufacturer Part Number:

    RVC2512FT2M00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    10

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.35 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    2000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    3000 V

RVC2512FT2M00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RVC2512FT2M00 is a rectangular pad with a size of 1.5mm x 2.5mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the RVC2512FT2M00 is rated for operation up to 155°C, it's essential to consider the derating curve for power dissipation. Above 125°C, the resistor's power rating decreases significantly. Ensure your design takes this into account to avoid overheating and premature failure.
  • The RVC2512FT2M00 is a moisture-sensitive device (MSD) with a MSL rating of 3. To prevent damage, store the components in a dry environment (less than 30% RH) and follow the recommended baking procedure before reflow soldering.
  • For optimal soldering results, use a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time of 20-30 seconds above 220°C. Avoid wave soldering or hand soldering, as this can cause damage to the component.
  • While the RVC2512FT2M00 is a robust component, it's essential to consider the mechanical stress it may be subjected to. Ensure your design takes into account the component's mechanical limitations and follows proper mounting and soldering techniques to minimize the risk of mechanical failure.

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RVC2512FT2M00 Overview

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