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RW612ET/A2IK - NXP

Description: TFBGA145 package

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PCB Footprints
RW612ET/A2IK - NXP PCB footprint - BGA - BGA - TFBGA145
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RW612ET/A2IK - NXP  - 3D model - BGA - TFBGA145
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RW612ET/A2IK Details

  • Manufacturer Part Number:

    RW612ET/A2IK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-145

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • JESD-30 Code:

    S-PBGA-B145

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    145

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA145,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.155 V

  • Supply Voltage-Min:

    1.01 V

  • Supply Voltage-Nom:

    1.05 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

RW612ET/A2IK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12271, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The RW612ET/A2IK has multiple power modes, including low-power modes. To configure the device for optimal power consumption, refer to the datasheet section 10.3, 'Power Management', and application note AN12271, which provides guidelines for power mode selection, clock frequency, and voltage scaling.
  • The RW612ET/A2IK has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to follow the thermal management guidelines in the datasheet section 10.4, 'Thermal Characteristics', and application note AN12271, which provides recommendations for heat sink design, thermal interface materials, and PCB thermal design.
  • NXP provides a Secure Boot solution for the RW612ET/A2IK, which includes a boot loader and firmware update mechanisms. Refer to the application note AN12272, 'Secure Boot and Firmware Update', for detailed guidelines on implementing secure boot and firmware updates.
  • To ensure EMC and minimize EMI, follow the guidelines in the datasheet section 10.5, 'Electromagnetic Compatibility', and application note AN12271, which provides recommendations for PCB design, component selection, and shielding.

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RW612ET/A2IK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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