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S10AC-HF - Comchip Technology

Description: Rectifiers RECTIFIER GEN PURP 50V 10A SMC

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S10AC-HF - Comchip Technology - PCB symbol
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PCB Footprints
S10AC-HF - Comchip Technology PCB footprint - Diodes Moulded - Diodes Moulded - SMC (DO-214AB)
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3D Models
S10AC-HF - Comchip Technology - 3D model - Diodes Moulded - SMC (DO-214AB)
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S10AC-HF Details

  • Manufacturer Part Number:

    S10AC-HF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2019-10-28

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6.38

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

S10AC-HF Frequently Asked Questions (FAQs)

  • Comchip recommends a 4-layer PCB with a dedicated power plane and a thermal pad connected to a heat sink or a thermal via to ensure efficient heat dissipation. A minimum of 2oz copper thickness is recommended for the power plane.
  • Comchip suggests using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. Additionally, ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C.
  • Comchip recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for at least 50V, placed as close as possible to the VIN pin to ensure stable operation.
  • Comchip suggests using a high-precision voltage reference, such as a bandgap reference, and ensuring that the output voltage is decoupled with a low-ESR capacitor (e.g., 10uF) to minimize noise and ripple.
  • Comchip recommends keeping the SW pin trace as short as possible, using a wide trace (at least 10 mils) to minimize inductance, and avoiding any vias or stubs near the SW pin to reduce electromagnetic interference (EMI).

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S10AC-HF Overview

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