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S110FP - onsemi

Description: High Surge Current Capability; Industrial Device Qualified per AEC-Q101 Standards; * See authorized use policy; Ultra Thin Profile - Package Height < 1.0 mm; Low Power Loss, High Efficiency; UL Flammability 94V-0 Classification; MSL 1 per J-STD-020; Larger Cathode Pad for Improved Power Dissipation; RoHS Compliant / Green Molding Compound

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Symbol
S110FP - onsemi - PCB symbol
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PCB Footprints
S110FP - onsemi PCB footprint - Other - Other - S110FP-2
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3D Models
S110FP - onsemi - 3D model - Other - S110FP-2
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S110FP Details

  • Manufacturer Part Number:

    S110FP

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AC

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.8 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.014 µs

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S110FP Frequently Asked Questions (FAQs)

  • A good PCB layout for the S110FP involves keeping the input and output traces separate, using a ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it perpendicular to the PCB can help reduce EMI.
  • To ensure the S110FP operates within the recommended junction temperature range, use a heat sink with a thermal resistance of 10°C/W or less, and ensure good airflow around the device. You can also use thermal interface materials to improve heat transfer.
  • The maximum allowed voltage on the EN pin is 6V. To protect it from overvoltage, use a voltage divider or a zener diode to clamp the voltage to a safe level. You can also use a voltage regulator to regulate the voltage on the EN pin.
  • To optimize the S110FP for low standby power consumption, ensure that the EN pin is driven low during shutdown, and that the input voltage is removed or reduced to a minimum. You can also use a low-power mode or a power gating technique to reduce standby power consumption.
  • The recommended input capacitor value for the S110FP is 10uF to 22uF, with a voltage rating of 10V or higher. A ceramic or electrolytic capacitor with low ESR is recommended. The capacitor should be placed close to the device and connected between the VIN pin and GND.

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S110FP Overview

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