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S1GFL - onsemi

Description: Glass Passivated Junction; UL Flammability 94V-0 Classification; Ultra Thin Profile – Maximum Height of 1.08 mm; RoHS Compliant / Green Mold Compound; MSL level 1

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PCB Footprints
S1GFL - onsemi PCB footprint - Other - Other - S1GFL-1
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S1GFL - onsemi  - 3D model - Other - S1GFL-1
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S1GFL Details

  • Manufacturer Part Number:

    S1GFL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    400 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    2 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S1GFL Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The thermal pad should be connected to the ground plane through multiple thermal vias to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider using a heat sink with a thermal resistance of 10°C/W or lower.
  • The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • The S1GFL requires a specific power sequencing order: VIN, then VOUT. Ensure that VIN is stable before applying VOUT. A power sequencing circuit or a supervisor IC can be used to ensure proper sequencing.
  • A low-ESR ceramic capacitor (X5R or X7R) with a value of 10uF to 22uF is recommended. This helps to filter out noise and ensure stable operation.

Trust Checks

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Manufacturer Collaborated
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S1GFL Overview

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