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S1M - onsemi

Description: Glass passivated junction.; Low profile package.

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PCB Footprints
S1M - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC (SMA)
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3D Models
S1M - onsemi  - 3D model - Diodes Moulded - DO-214AC (SMA)
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S1M Details

  • Manufacturer Part Number:

    S1M

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    ROHS COMPLIANT, SMA, 2 PIN

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.4 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    1 µA

  • Reverse Recovery Time-Max:

    1.8 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

S1M Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the EN pin is 6V, regardless of the input voltage (VIN). Exceeding this voltage may damage the device.
  • Yes, but ensure the device is properly heat-sunk and the PCB is designed to handle high currents. Also, consider the device's power dissipation and thermal limitations.
  • Check the input voltage, output voltage, and enable pin voltage. Verify the PCB layout and thermal design. Use an oscilloscope to check for voltage spikes or oscillations.

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S1M Overview

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Part Image S1MR2G Taiwan Semiconductor

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Part Image RS1M-TR2G Taiwan Semiconductor

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Part Image RS1MR2G Taiwan Semiconductor

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