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S25FL128LAGMFI003 - Infineon

Description: 256Mbit (32Mbyte)/128Mbit (16Mbyte), 3.0 V FL-L Flash Memory

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S25FL128LAGMFI003 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S25FL128LAGMFI003 - Infineon  - 3D model - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S25FL128LAGMFI003 Details

  • Manufacturer Part Number:

    S25FL128LAGMFI003

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    2.65 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65nm

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    7.5 mm

  • Write Protection:

    HARDWARE

S25FL128LAGMFI003 Frequently Asked Questions (FAQs)

  • The S25FL128LAGMFI003 can operate from -40°C to +125°C, with a maximum junction temperature of 150°C.
  • The S25FL128LAGMFI003 is rated for a minimum of 100,000 erase cycles per sector, and 10,000 erase cycles per block.
  • The typical programming time for a page is around 1.2 ms, with a maximum time of 3.2 ms.
  • Yes, the S25FL128LAGMFI003 is suitable for use in MCP or SiP designs, but it's recommended to consult with Infineon's application engineers for specific guidance.
  • No, the S25FL128LAGMFI003 is a parallel NOR flash device and is not compatible with the JEDEC eMMC standard, which is used for embedded MMC devices.

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