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S25FL256LAGNFB010 - Infineon

Description: NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 8ns Automotive 8-Pin WSON EP Tray

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PCB Footprints
S25FL256LAGNFB010 - Infineon PCB footprint - Small Outline No-lead - Small Outline No-lead - WND008 - 8-Contact WSON 5 mm x 6 mm
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3D Models
S25FL256LAGNFB010 - Infineon  - 3D model - Small Outline No-lead - WND008 - 8-Contact WSON 5 mm x 6 mm
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S25FL256LAGNFB010 Details

  • Manufacturer Part Number:

    S25FL256LAGNFB010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WSON-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    6 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    33554432 words

  • Number of Words Code:

    32000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWSON

  • Package Equivalence Code:

    SOLCC8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00003 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65nm

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    5 mm

  • Write Protection:

    HARDWARE

S25FL256LAGNFB010 Frequently Asked Questions (FAQs)

  • The S25FL256LAGNFB010 can operate from -40°C to +125°C, making it suitable for industrial and automotive applications.
  • The S25FL256LAGNFB010 can handle up to 100,000 erase cycles, making it suitable for applications that require frequent data updates.
  • The S25FL256LAGNFB010 has a data retention period of 20 years at 125°C, ensuring that stored data remains valid for an extended period.
  • Yes, the S25FL256LAGNFB010 can be used in an MCP configuration, allowing it to be combined with other devices such as microcontrollers or other memory devices.
  • The typical programming time for the S25FL256LAGNFB010 is around 3-5 seconds for a full 256 Mbit erase and program cycle.

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