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S25FL256SAGMFB000 - Infineon

Description: 128 Mb (16 MB)/256 Mb (32 MB) FL-S Flash SPI Multi-I/O, 3.0V

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S25FL256SAGMFB000 - Infineon - PCB symbol
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PCB Footprints
S25FL256SAGMFB000 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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3D Models
S25FL256SAGMFB000 - Infineon - 3D model - Small Outline Packages - 16-Lead Wide Plastic Small Outline Package (300-mil Body Width)
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S25FL256SAGMFB000 Details

  • Manufacturer Part Number:

    S25FL256SAGMFB000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Technology:

    65 nm

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    40

S25FL256SAGMFB000 Frequently Asked Questions (FAQs)

  • The S25FL256SAGMFB000 has an operating temperature range of -40°C to +85°C, and an extended temperature range of -40°C to +125°C for industrial and automotive applications.
  • The HOLD# pin should be driven low to pause the current operation and enter a low-power state. When HOLD# is low, the device will ignore any further input signals until HOLD# is driven high again.
  • The WP# pin is used to protect the entire memory array or specific sectors from being written or erased. When WP# is low, the device will prevent any write or erase operations.
  • The S25FL256SAGMFB000 has a density of 256 Mbits and is organized as 32,768 pages of 8192 bytes each.
  • The typical programming time for a page is 1.5 ms, but this can vary depending on the operating conditions and the specific application.

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S25FL256SAGMFB000 Overview

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