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S25FS512SFABHB210 - Infineon

Description: NOR Flash IC 512 Mb FLASH MEMORY

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PCB Footprints
S25FS512SFABHB210 - Infineon PCB footprint - BGA - BGA - Ball Grid Array 24-Ball FBGA 8.0 x 6.0 x 1.2 mm (FAB024)
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3D Models
S25FS512SFABHB210 - Infineon  - 3D model - BGA - Ball Grid Array 24-Ball FBGA 8.0 x 6.0 x 1.2 mm (FAB024)
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S25FS512SFABHB210 Details

  • Manufacturer Part Number:

    S25FS512SFABHB210

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Memory IC Type:

    FLASH

  • Moisture Sensitivity Level:

    3

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

S25FS512SFABHB210 Frequently Asked Questions (FAQs)

  • The S25FS512SFABHB210 has an operating temperature range of -40°C to 125°C, making it suitable for industrial and automotive applications.
  • The S25FS512SFABHB210 has a minimum of 100,000 erase cycles, ensuring reliable data storage and retrieval over its lifespan.
  • The typical programming time for the S25FS512SFABHB210 is around 3-5 milliseconds per 256-byte page, depending on the operating conditions and system configuration.
  • Yes, the S25FS512SFABHB210 supports simultaneous read and write operations, allowing for efficient data transfer and processing.
  • The WP# (Write Protect) pin is used to prevent accidental writes to the flash memory. When the WP# pin is low, the entire memory array is protected from writes.

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