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S26KL128SDABHI020 - Infineon

Description: NOR Flash Nor

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PCB Footprints
S26KL128SDABHI020 - Infineon PCB footprint - BGA - BGA - 24-Ball 6x8 mm (FAB024)-
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3D Models
S26KL128SDABHI020 - Infineon  - 3D model - BGA - 24-Ball 6x8 mm (FAB024)-
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S26KL128SDABHI020 Details

  • Manufacturer Part Number:

    S26KL128SDABHI020

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1 mm

  • Serial Bus Type:

    HYPERBUS

  • Standby Current-Max:

    0.000004 A

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE

S26KL128SDABHI020 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide for the S26KL128SDABHI020 in their application note AN215. It includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and reliability.
  • The S26KL128SDABHI020 has a built-in secure boot mechanism that can be implemented using Infineon's Secure Boot Loader (SBL) software. The SBL provides a secure way to boot the device and ensures that only authorized firmware is executed. Refer to Infineon's Secure Boot Loader documentation for implementation details.
  • The S26KL128SDABHI020 has an operating temperature range of -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within the recommended temperature range for optimal performance.
  • Infineon provides a Flash Programming Tool (FPT) that can be used to troubleshoot issues with the device's flash memory. The FPT allows you to read, write, and erase the flash memory, as well as perform other diagnostic functions. Refer to Infineon's FPT documentation for more information.
  • The recommended POR and BOD settings for the S26KL128SDABHI020 are specified in the datasheet. However, the optimal settings may vary depending on the specific application and power supply characteristics. It's recommended to consult with Infineon's technical support or refer to their application notes for guidance on selecting the appropriate POR and BOD settings.

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