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S28HS01GTGZBHI030 - Infineon

Description: IC FLASH 1GBIT SPI/OCTAL 24FBGA

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PCB Footprints
S28HS01GTGZBHI030 - Infineon PCB footprint - BGA - BGA - 24-ball 8 x 8 mm (VAC024)
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3D Models
S28HS01GTGZBHI030 - Infineon  - 3D model - BGA - 24-ball 8 x 8 mm (VAC024)
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S28HS01GTGZBHI030 Details

  • Manufacturer Part Number:

    S28HS01GTGZBHI030

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    12

  • Clock Frequency-Max (fCLK):

    200 MHz

  • JESD-30 Code:

    S-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    1 mm

  • Serial Bus Type:

    OSPI

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE

S28HS01GTGZBHI030 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2019-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • The thermal shutdown feature is enabled by default. During power-up, the device will automatically recover from thermal shutdown once the junction temperature drops below 150°C. No external intervention is required.
  • The maximum allowed voltage on the VCC pin during power-down is 5.5V. Exceeding this voltage may cause damage to the device.
  • Yes, the device is rated for operation up to 125°C. However, the maximum junction temperature (Tj) should not exceed 150°C. Ensure proper thermal design and cooling to maintain a safe operating temperature.
  • The device has an internal overcurrent protection feature. However, it's recommended to implement an external overcurrent protection circuit to ensure reliable operation. Infineon provides guidelines for overcurrent protection in the application note AN2019-01.

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