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S29CD016J0MFAM010 - Infineon

Description: FLASH - NOR Memory IC 16Mbit Parallel 56 MHz 54 ns 80-FBGA (13x11)

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S29CD016J0MFAM010 - Infineon PCB footprint - BGA - BGA - LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm)
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S29CD016J0MFAM010 - Infineon  - 3D model - BGA - LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm)
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S29CD016J0MFAM010 Details

  • Manufacturer Part Number:

    S29CD016J0MFAM010

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Access Time-Max:

    54 ns

  • Additional Feature:

    SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • JESD-30 Code:

    R-PBGA-B80

  • JESD-609 Code:

    e0

  • Length:

    13 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    32

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    16,30

  • Number of Terminals:

    80

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA80,8X10,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.7 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.4 mm

  • Sector Size:

    2K,16K

  • Standby Current-Max:

    0.00006 A

  • Supply Current-Max:

    0.09 mA

  • Supply Voltage-Max (Vsup):

    2.75 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    2.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    11 mm

S29CD016J0MFAM010 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S29CD016J0MFAM010 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, which is -65°C to 150°C.
  • To prevent damage, it's crucial to follow the recommended soldering and rework guidelines provided in the datasheet. This includes using a soldering iron with a temperature not exceeding 260°C, and limiting the exposure time to 10 seconds or less. Additionally, the device should not be subjected to more than three reflow cycles.
  • The maximum allowed voltage on the VCC pin is 3.6V. Exceeding this voltage can cause permanent damage to the device. It's essential to ensure that the power supply voltage remains within the recommended operating range of 2.7V to 3.6V.
  • The S29CD016J0MFAM010 has built-in security features, such as the Secure Boot mechanism, which can be implemented using the device's One-Time Programmable (OTP) memory. This involves storing a secure boot loader in the OTP memory, which is then used to authenticate the firmware during the boot process. Consult the datasheet and application notes for more information on implementing a secure boot mechanism.
  • The typical programming time for the S29CD016J0MFAM010 depends on the programming method and the size of the data being programmed. However, according to the datasheet, the typical programming time for a single byte is around 10μs, while the typical erase time for a sector is around 1.5ms.

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S29CD016J0MFAM010 Overview

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