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S29CD016J0MQFM030 - Infineon

Description: FLASH - NOR Memory IC 16Mbit Parallel 56 MHz 54 ns 80-PQFP (14x20)

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PCB Footprints
S29CD016J0MQFM030 - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - 80-Pin PQFP
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S29CD016J0MQFM030 - Infineon  - 3D model - Quad Flat Packages - 80-Pin PQFP
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S29CD016J0MQFM030 Details

  • Manufacturer Part Number:

    S29CD016J0MQFM030

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Access Time-Max:

    54 ns

  • Additional Feature:

    SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • JESD-30 Code:

    R-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    32

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    16,30

  • Number of Terminals:

    80

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX32

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP80,.7X.9,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    2.7 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    3.35 mm

  • Sector Size:

    2K,16K

  • Standby Current-Max:

    0.00006 A

  • Supply Current-Max:

    0.09 mA

  • Supply Voltage-Max (Vsup):

    2.75 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    2.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    14 mm

S29CD016J0MQFM030 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide for the S29CD016J0MQFM030 in their application note AN215. It includes guidelines for pad layout, thermal management, and signal routing to ensure optimal performance and reliability.
  • The S29CD016J0MQFM030 requires a specific power-up and power-down sequence to ensure proper operation. Infineon recommends following the power-up and power-down sequences outlined in the datasheet, which include specific voltage and timing requirements.
  • The S29CD016J0MQFM030 has a maximum junction temperature of 150°C. To ensure reliable operation, Infineon recommends using thermal management techniques such as heat sinks, thermal interfaces, and airflow management to keep the device within its recommended operating temperature range.
  • The S29CD016J0MQFM030 supports various error correction and detection mechanisms, including ECC and CRC. Infineon provides guidelines and examples for implementing these mechanisms in their application notes and software development kits.
  • The S29CD016J0MQFM030 has built-in security features such as secure boot, secure firmware updates, and data encryption. Infineon provides documentation and software development kits to help implement these security features in customer applications.

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S29CD016J0MQFM030 Overview

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