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S29GL128S10TFV010 - Infineon

Description: NOR Flash PNOR FLASH - NOR Memory IC 128Mbit Parallel 100 ns 56-TSOP

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PCB Footprints
S29GL128S10TFV010 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 56-pin TSOP (18.4 × 14.0 × 1.2 mm) TS056/TSR056 package outline (PG-TSOP-56-800), 002-15549
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3D Models
S29GL128S10TFV010 - Infineon  - 3D model - Small Outline Packages - 56-pin TSOP (18.4 × 14.0 × 1.2 mm) TS056/TSR056 package outline (PG-TSOP-56-800), 002-15549
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for S29GL128S10TFV010
  • Part Number S29GL128S10TFV010
  • Manufacturer Infineon
  • Pin Count 56
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 56-pin TSOP (18.4 × 14.0 × 1.2 mm) TS056/TSR056 package outline (PG-TSOP-56-800), 002-15549
  • Released Date Jan 17, 2025
  • Last Modified Date Jan 17, 2025 4:08 AM UTC
  • Pinout / Pin List Click Here (Member Only)

S29GL128S10TFV010 Details

  • Manufacturer Part Number:

    S29GL128S10TFV010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Access Time-Max:

    100 ns

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    18.4 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    128

  • Number of Terminals:

    56

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.78,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Page Size:

    16 words

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    64K

  • Standby Current-Max:

    0.0002 A

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    14 mm

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S29GL128S10TFV010 Overview

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Part Image S29GL128S10TFV023 Cypress Semiconductor

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Part Image S29GL128S10TFB013 Cypress Semiconductor

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Part Image S29GL128S10TFV013 Spansion

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