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S29GL256P10TFIV20 - Spansion

Description: Gigabit, 512 Megabit, 256 Megabit and 128 Megabit 3.0 Volt-only Page Mode Flash Memory featuring 56-PIN TSOP 90 nm MirrorBit Process Technology

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PCB Footprints
S29GL256P10TFIV20 - Spansion PCB footprint - Small Outline Packages - Small Outline Packages - 56-Pin TSOP
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3D Models
S29GL256P10TFIV20 - Spansion  - 3D model - Small Outline Packages - 56-Pin TSOP
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S29GL256P10TFIV20 Details

  • Manufacturer Part Number:

    S29GL256P10TFIV20

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TSOP1

  • Package Description:

    TSOP-56

  • Pin Count:

    56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Spansion

  • Access Time-Max:

    100 ns

  • JESD-30 Code:

    R-PDSO-G56

  • Length:

    18.4 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    14 mm

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S29GL256P10TFIV20 Overview

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