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S29PL127J60BFI040 - Infineon

Description: NOR Flash PNOR

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PCB Footprints
S29PL127J60BFI040 - Infineon PCB footprint - BGA - BGA - VBG080—80-Ball Fine-pitch Ball Grid Array 8 × 11 mm Package (PL127J)
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3D Models
S29PL127J60BFI040 - Infineon  - 3D model - BGA - VBG080—80-Ball Fine-pitch Ball Grid Array 8 × 11 mm Package (PL127J)
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S29PL127J60BFI040 Details

  • Manufacturer Part Number:

    S29PL127J60BFI040

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-80

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Access Time-Max:

    60 ns

  • Additional Feature:

    TOP AND BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM/TOP

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B80

  • Length:

    11 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Sectors/Size:

    16,254

  • Number of Terminals:

    80

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA80,8X12,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Page Size:

    8 words

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    3 V

  • Ready/Busy:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Sector Size:

    4K,32K

  • Standby Current-Max:

    0.000005 A

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    8 mm

  • Write Cycle Time-Max (tWC):

    0.00006 ms

S29PL127J60BFI040 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the S29PL127J60BFI040 can be found in the Infineon application note AN215 'Layout Recommendations for BGA Packages'. It provides guidelines for PCB design, including pad layout, thermal vias, and signal routing.
  • The HOLD# signal should be kept high during power-up and power-down sequences to prevent any unwanted commands from being executed. It's recommended to tie HOLD# to VCC through a pull-up resistor to ensure it remains high during these sequences.
  • The S29PL127J60BFI040 supports up to 100,000 program/erase cycles per sector. However, it's recommended to follow the guidelines in the datasheet for wear leveling and error correction to ensure the device's endurance.
  • The S29PL127J60BFI040 supports a secure erase feature that can be initiated by writing a specific command sequence to the device. Refer to the datasheet for the exact command sequence and timing requirements. Additionally, ensure that the device is properly powered and clocked during the erase operation.
  • The S29PL127J60BFI040 has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to follow proper thermal management practices, such as providing adequate heat dissipation, using thermal vias, and avoiding thermal hotspots on the PCB.

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