S32E288AACAAMJGT - NXP

S32E288AACAAMJGT Details

• Manufacturer Part Number:

  S32E288AACAAMJGT

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  MABGA-975

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.30

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  14

• JESD-30 Code:

  S-PBGA-B975

• Length:

  27 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  975

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA975,32X32,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Screening Level:

  AEC-Q100; ISO 26262-ASIL D

• Seated Height-Max:

  1.82 mm

• Supply Voltage-Max:

  0.87 V

• Supply Voltage-Min:

  0.77 V

• Supply Voltage-Nom:

  0.825 V

• Surface Mount:

  YES

• Technology:

  FINFET

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  SoC